LPWA Module Series
BG952A-GL_QuecOpen_Hardware_Design
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Table 38: Recommended Thermal Profile Parameters
1. If the module requires conformal coating, DO NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
3. Due to the SMT process complexity, please contact Quectel Technical Support in advance regarding
any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic
soldering) that is not mentioned in
document [6]
.
8.3. Packaging
The module is delivered in a tape carrier packaging and details are as follows:
8.3.1. Carrier Tape
Dimension details:
Factor
Recommendation
Soak Zone
Max slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max slope
1–3 °C/s
Reflow time (D: over 220 °C)
45–70 s
Max temperature
235–246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE