LPWA Module Series
BG77 Hardware Design
BG77_Hardware_Design 68 / 76
7.2. Recommended Footprint
12.90±0.15
14.90±0.15
11.90
13.90
1.00
6.45
7.45
7.45
6.45
1.30
0.65
1.15
0.65
0.85
0.85
1.30
1.00
1.95
0.65
R0.35
R0.35
6.45
4.15
5.30
Figure 34: Recommended Footprint (Top View)
1. For easy maintenance of the module, please keep about 3mm between the module and other
components on the host PCB.
2. Keep all reserved pins open.
3. For stencil design requirements of the module, please refer to
document [5]
.
NOTES
Pin 1
