Installation Manual
2. Preparation before Installation
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❖
Be sure that the cabinet is firm enough to bear the weight of the QSW-6900-56LF and its
installation accessories.
❖
Be sure that the dimensions of the cabinet is appropriate for installation of the QSW-6900-
56LF that can reserve a certain space for the front, back, left and right panels for heat
dissipation.
❖
The cabinet should be properly grounded.
2.2.2
Ventilation Requirements
For the QSW-6900-56LF series products, leave sufficient space in the front and at the back of the
chassis (at least 20cm) for ventilation. After various cables are connected, bundle the cables or
place them in the cable management bracket to avoid blocking air inlets. Dust the device every
three months to avoid blocking the ventilation openings.
2.2.3
Temperature and Humidity Requirements
To ensure the normal operation and a prolonged service life of the QSW-6900-56LF, maintain an
appropriate temperature and humidity in the equipment room. The equipment room with too
high or too low temperature and humidity for a long period of time may damage the equipment.
❖
In an environment with high relative humidity, the insulating material may have bad
insulation or even leak electricity. And sometimes the materials may suffer from mechanical
performance change and metallic parts may get rusted.
❖
On the other hand, in an environment with low relative humidity, the insulating strip may
dry and shrink, and static electricity may occur easily and endanger the circuit on the device.
❖
In an environment with high temperature, the equipment is subjected to even greater harm,
as its performance may degrade significantly and its service life may be shortened at high
temperature for long that expedites the aging process.
Temperature and humidity requirements of the QSW-6900-56LF:
Model
Working Temperature
Working Humidity
QSW-6900-56LF
0ºC
to 45
ºC
/ 32
º
F to 1
13º
F
10% to 90%
The ambient temperature and humidity are measured at the point that is 1.5 m above the
floor and 0.4 m before the device when there is no protective plate in front or at the back of
the device rack.
2.2.4
Cleanness Requirements
Dust poses the top threat to the running of the device. The indoor dust falling on the device may
be adhered by the static electricity, causing poor contact of the metallic joint. Such electrostatic
adherence may occur more easily when the relative humidity is low, not only affecting the
service life of the device, but also causing communication faults. The following table shows the
requirements for the dust content and granularity in the equipment room.