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Philips Semiconductors

TDA8946J

2 x 15 W stereo BTL audio amplifier

Product specification

Rev. 02 — 14 March 2000

18 of 23

9397 750 06863

© Philips Electronics N.V. 2000. All rights reserved.

17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260

°

C; solder at this

temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T

stg(max)

).

If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300

°

C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400

°

C, contact may be up to 5 seconds.

17.4 Package related soldering information

[1]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package

Soldering method

Dipping

Wave

DBS, DIP, HDIP, SDIP, SIL

suitable

suitable

[1]

Summary of Contents for TDA8946J

Page 1: ...le with all other types in the TDA894x family One PCB footprint accommodates both the mono and the stereo products 2 Features Few external components Fixed gain Standby and mute mode No on off switching plops Low standby current High supply voltage ripple rejection Outputs short circuit protected to ground supply and across the load Thermally protected Printed circuit board compatible 3 Applicatio...

Page 2: ...e gain 31 32 33 dB SVRR supply voltage ripple rejection 50 65 dB Table 1 Quick reference data continued Symbol Parameter Conditions Min Typ Max Unit Table 2 Ordering information Type number Package Name Description Version TDA8946J DBS17P plastic DIL bent SIL power package 17 leads lead length 12 mm SOT243 1 Fig 1 Block diagram idth MBK929 STANDBY MUTE LOGIC SHORT CIRCUIT AND TEMPERATURE PROTECTIO...

Page 3: ...11 12 13 14 15 16 17 OUT1 GND1 VCC1 OUT1 n c IN1 n c IN1 IN2 MODE SVR IN2 n c OUT2 GND2 VCC2 OUT2 Table 3 Pin description Symbol Pin Description OUT1 1 negative loudspeaker terminal 1 GND1 2 ground channel 1 VCC1 3 supply voltage channel 1 OUT1 4 positive loudspeaker terminal 1 n c 5 not connected IN1 6 positive input 1 n c 7 not connected IN1 8 negative input 1 IN2 9 negative input 2 MODE 10 mode...

Page 4: ...s connected via a capacitor to the signal ground which should be as close as possible to the SVR electrolytic capacitor ground Note that the DC level of the input pins is half of the supply voltage VCC so coupling capacitors for both pins are necessary The input cut off frequency is 1 For Ri 45 kΩ and Ci 220 nF 2 As shown in Equation 1 and 2 large capacitor values for the inputs are not necessary ...

Page 5: ...power output for transferring the loudest parts without distortion At VCC 18 V RL 8 Ω and Po 10 W at THD 0 1 see Figure 6 the Average Listening Level ALL music power without any distortion yields Po ALL 10 W 15 85 631 mW The power dissipation can be derived from Figure 11 on page 11 for 0 dB respectively 12 dB headroom For the average listening level a power dissipation of 8 W can be used for a he...

Page 6: ...ming of the RC circuit on the MODE pin 8 4 Supply Voltage Ripple Rejection SVRR The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a bandwidth of 10 Hz to 80 kHz Figure 13 on page 12 illustrates the SVRR as function of the frequency A larger capacitor value on the SVR pin improves the ripple rejection behaviour at the lower frequencies 8 5 Built in protection circuits The T...

Page 7: ...utput current 2 A Tstg storage temperature non operating 55 150 C Tamb operating ambient temperature 40 70 C Ptot total power dissipation 28 W VCC sc supply voltage to guarantee short circuit protection 15 V Table 6 Thermal characteristics Symbol Parameter Conditions Value Unit Rth j a thermal resistance from junction to ambient in free air 40 K W Rth j mb thermal resistance from junction to mount...

Page 8: ...kHz so including noise Fig 3 Quiescent supply current as function of supply voltage Fig 4 Quiescent supply current as function of mode voltage handbook halfpage 50 40 30 20 10 0 0 4 8 12 16 VCC V Iq mA 20 MGU005 handbook halfpage 50 40 30 20 10 0 0 4 8 12 16 VMODE V Iq mA 20 MGU006 VCC 18 V 12 V Table 8 Dynamic characteristics VCC 18 V Tamb 25 C RL 8 Ω f 1 kHz VMODE 0 V measured in test circuit Fi...

Page 9: ...ps Electronics N V 2000 All rights reserved Fig 5 Output voltage as function of mode voltage Fig 6 Total harmonic distortion as function of output power handbook full pagewidth VMODE V 20 MGU008 16 8 4 12 0 Vo V 10 1 10 3 10 2 10 1 10 4 10 5 VCC 18 V 12 V handbook halfpage THD 10 2 102 10 1 10 1 Po W 102 10 1 10 1 10 2 MGU003 VCC 12 V 18 V ...

Page 10: ...tortion as function of frequency THD 10 Fig 8 Output power as function of supply voltage Fig 9 Total power dissipation as function of supply voltage handbook full pagewidth 10 1 10 1 10 2 10 102 103 104 105 106 MGU004 VCC 12 V VCC 18 V VCC 12 V VCC 18 V Po 0 1 W Po 1 W THD f Hz handbook halfpage 20 16 8 4 12 0 0 4 8 12 16 VCC V Po W 20 MGU010 RL 8 Ω 16 Ω handbook halfpage 20 16 8 4 12 0 0 4 8 12 1...

Page 11: ... V Fig 10 Efficiency as function of output power Fig 11 Power dissipation as function of output power No bandpass filter applied Fig 12 Channel separation as function of frequency handbook halfpage 100 80 40 20 60 0 0 4 8 12 16 MGU013 RL 16 Ω 8 Ω Po W η handbook halfpage 20 16 8 4 12 0 0 4 8 12 16 P W MGU012 RL 8 Ω 16 Ω Po W handbook halfpage 0 20 40 60 80 100 10 102 103 104 105 f Hz αcs dB MGU009...

Page 12: ...N V 2000 All rights reserved VCC 18 V RS 0 Ω Vripple 700 mV RMS no bandpass filter applied Curves A inputs short circuited Curves B inputs short circuited and connected to ground asymmetrical application Fig 13 Supply voltage ripple rejection as function of frequency handbook full pagewidth SVRR dB 102 103 104 105 10 f Hz 20 0 40 60 80 MGU007 CH1 B A CH2 ...

Page 13: ...erved 13 Internal circuitry Table 9 Internal circuitry Pin Symbol Equivalent circuit 6 and 8 IN1 and IN1 12 and 9 IN2 and IN2 1 and 4 OUT1 and OUT1 14 and 17 OUT2 and OUT2 10 MODE 11 SVR 1 5 kΩ 1 5 kΩ 45 kΩ 45 kΩ VCC VCC VCC MGL946 1 2 VCC SVR 8 9 6 12 40 Ω 100 Ω MGL947 1 4 14 17 1 2 VCC 1 kΩ 20 kΩ OFF HIGH MUTE HIGH 1 kΩ VCC VCC VCC MGL949 10 Standby 20 kΩ 20 kΩ VCC MGL948 11 ...

Page 14: ... with the small AC input signals The small signal ground tracks should be physically located as far as possible from the power ground tracks Supply and output tracks should be as wide as possible for delivering maximum output power Fig 14 Application diagram agewidth 3 16 OUT1 RL 8 Ω Ri 45 kΩ Rs Symmetrical input Ri 45 kΩ RL 8 Ω OUT1 IN1 IN1 OUT2 OUT2 GND MGU014 IN2 IN2 MODE SVR 1 8 220 nF 6 9 12 ...

Page 15: ...vents oscillations For suppressing higher frequency transients spikes on the supply line a capacitor with low ESR typical 100 nF has to be placed as close as possible to the device For suppressing lower frequency noise and ripple signals a large electrolytic capacitor e g 1000 µF or greater must be placed close to the device The bypass capacitor on the SVR pin reduces the noise and ripple on the m...

Page 16: ...is 150 50 100 C P Rth tot 100 C Rth tot 100 18 5 56 K W Rth h a Rth tot Rth j mb 5 56 4 5 1 06 K W The calculation above is for an application at worst case stereo sine wave output signals In practice music signals will be applied which decreases the maximum power dissipation to approximately half of the sine wave power dissipation see Section 8 2 2 This allows for the use of a smaller heatsink P ...

Page 17: ...iginal dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included SOT243 1 0 5 10 mm scale D L E A c A2 L3 Q w M bp 1 d D Z e e x h 1 17 j Eh non concave 97 12 16 99 12 17 DBS17P plastic DIL bent SIL power package 17 leads lead length 12 mm SOT243 1 view B mounting base side m 2 e v M B UNIT A e1 A2 bp c D 1 E 1 Z 1 d e Dh L L3 m mm 17 0 15 5 4 6 4 4 0 75 0 60 0 48...

Page 18: ...ves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstg max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit 17 3 Manual soldering Apply the soldering iron 24 V...

Page 19: ...on 8 2 2 Headroom on page 5 added Section 8 3 Mode selection Standby mode VMODE VCC 0 5 V changed to VCC 0 5 V VMODE VCC The power consumption of the TDA8946J will be reduced to 0 18 mW added Mute mode the DC level of the input and output pins remain on half the supply voltage added 2 5 V VMODE VCC 1 5 V changed to 3 V VMODE VCC 1 5 V Section 8 3 1 Switch on and switch off on page 6 added Section ...

Page 20: ...0314 Modifications Section 14 1 Printed circuit board PCB on page 14 added Figure 15 figure added Section 14 2 Thermal behaviour and heatsink calculation on page 16 added Section 15 Test information on page 16 Section 15 1 updated Section 15 2 Test conditions on page 16 added 01 19990414 Preliminary specification initial version Table 11 Revision history continued Rev Date CPCN Description ...

Page 21: ...ese products can reasonably be expected to result in personal injury Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application Right to make changes Philips Semiconductors reserves the right to make changes without notice in the products in...

Page 22: ... 5214 Fax 60 37 57 4880 Mexico Tel 9 5 800 234 7381 Middle East see Italy Netherlands Tel 31 40 278 2785 Fax 31 40 278 8399 New Zealand Tel 64 98 49 4160 Fax 64 98 49 7811 Norway Tel 47 22 74 8000 Fax 47 22 74 8341 Philippines Tel 63 28 16 6380 Fax 63 28 17 3474 Poland Tel 48 22 5710 000 Fax 48 22 5710 001 Portugal see Spain Romania see Italy Russia Tel 7 095 755 6918 Fax 7 095 755 6919 Singapore ...

Page 23: ... Pinning 3 7 2 Pin description 3 8 Functional description 4 8 1 Input configuration 4 8 2 Power amplifier 5 8 2 1 Output power measurement 5 8 2 2 Headroom 5 8 3 Mode selection 5 8 3 1 Switch on and switch off 6 8 4 Supply Voltage Ripple Rejection SVRR 6 8 5 Built in protection circuits 6 8 5 1 Short circuit protection 6 8 5 2 Thermal shutdown protection 6 9 Limiting values 7 10 Thermal characteri...

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