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1997 Jul 15

13

Philips Semiconductors

Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook” (order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260

°

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

°

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

°

C, contact may be up to 5 seconds.

SO

R

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

°

C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

°

C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

°

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

°

C within

6 seconds. Typical dwell time is 4 seconds at 250

°

C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

°

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

°

C.

Summary of Contents for TDA7053A

Page 1: ...DATA SHEET Product specification Supersedes data of 1995 Nov 09 File under Integrated Circuits IC01 1997 Jul 15 INTEGRATED CIRCUITS TDA7053A Stereo BTL audio output amplifier with DC volume control ...

Page 2: ...ction circuit is built in The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA typical 300 mA This level of 100 mA allows for headphone applications single ended QUICK REFERENCE DATA ORDERING INFORMATION SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT VP supply voltage 4 5 18 V Pout output power VP 6 V TDA7053A RL 8 Ω 0 85 1 0 W TDA7...

Page 3: ...M Fig 1 Block diagram MSA717 2 I i I i Ι STABILIZER TEMPERATURE PROTECTION Vref 13 2 4 16 I i I i ΙΙ 9 8 6 12 14 power ground 1 power ground 2 10 7 signal ground input 1 DC volume control 1 input 2 DC volume control 2 TDA7053A TDA7053AT 5 V P positive output 1 negative output 1 negative output 2 1 3 11 15 not connected positive output 2 ...

Page 4: ... DC volume control stages are integrated into the input stages so that no coupling capacitors are required and a low offset voltage is still maintained The minimum supply voltage also remains low The BTL principle offers the following advantages Lower peak value of the supply current The frequency of the ripple on the supply voltage is twice the signal frequency Consequently a reduced power supply...

Page 5: ...um sine wave dissipation is 2 0 46 W 0 92 W The Rth j a of the package is 95 K W therefore Tamb max 150 95 0 92 62 6 C SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VP supply voltage 18 V IORM repetitive peak output current 1 25 A IOSM non repetitive peak output current 1 5 A Ptot total power dissipation Tamb 25 C TDA7053A 2 5 W TDA7053AT 1 32 W tsc short circuit time 1 hr Vn input voltage pins 2 4 6 a...

Page 6: ...VDC1 VDC2 7 The noise output voltage RMS value is measured with RS 5 kΩ unweighted SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT VP supply voltage 4 5 18 V Iq tot total quiescent current VP 6 V RL note 1 22 25 mA Maximum gain V2 8 1 4 V Pout output power THD 10 TDA7053A 1 0 1 1 W TDA7053AT 0 5 0 55 W THD total harmonic distortion TDA7053A Pout 0 5 W 0 3 1 TDA7053AT Pout 0 25 W 0 3 1 Gv voltage gain...

Page 7: ...4 THD as a function of output power 1 VP 4 5 V 2 VP 6 V RL 8 Ω 3 VP 12 V RL 25 Ω handbook halfpage 12 THD Pout W 0 8 10 2 10 1 1 MBG671 10 4 1 2 3 Fig 5 THD as a function of frequency 1 Gv 30 dB Po 0 1 W 2 Gv 40 dB Po 0 1 W handbook halfpage 102 MBG669 10 1 10 2 10 1 f kHz THD 10 0 4 6 8 2 2 1 Fig 6 Output power as a function of supply voltage 1 RL 8 Ω 2 RL 16 Ω 3 RL 25 Ω handbook halfpage 0 VP V ...

Page 8: ...668 12 Pdiss W 2 3 1 Fig 8 Voltage gain as a function of volume control voltage handbook halfpage 0 Gv dB 2 0 VVC V 80 40 80 120 40 0 MBG667 0 4 0 8 1 2 1 6 Fig 9 Noise voltage as a function of volume control voltage f 22 Hz to 22 kHz handbook halfpage 2 0 VVC V 0 10 2 10 1 MBG664 1 0 4 0 8 1 2 1 6 Vno mV Fig 10 SVRR as a function of frequency 1 VDC 1 4 V Vripple 0 2 V 2 VDC 0 4 V Vripple 0 2 V ha...

Page 9: ...wer as a function of the supply voltage has been measured at THD 10 The maximum output power is limited by the maximum power dissipation and the maximum available output current The maximum input signal voltage is measured at THD 1 at the output with a voltage gain of 0 dB To avoid instabilities and too high distortion the input ground and power ground must be separated as far as possible and conn...

Page 10: ...trolytic capacitor is connected close to pin 5 2 RL 8 Ω handbook full pagewidth MBG673 16 13 TEMPERATURE MCL PROTECTION STABILIZER 12 9 10 14 7 220 µF 100 nF 5 1 2 2 VP 6 V VP 6 V 6 8 Rs 5 kΩ 1 MΩ 1 µF Rs 5 kΩ DC volume signal ground volume control volume control power ground 470 nF 470 nF input 1 input 2 TDA7053A 4 2 I i I i I i I i maximum voltage gain 34 dB 2 8 22 kΩ 56 kΩ 1 µF maximum voltage ...

Page 11: ...10 02 95 01 19 A min A max b max w ME e1 1 40 1 14 0 055 0 045 0 53 0 38 0 32 0 23 21 8 21 4 0 86 0 84 6 48 6 20 0 26 0 24 3 9 3 4 0 15 0 13 0 254 2 54 7 62 0 30 8 25 7 80 0 32 0 31 9 5 8 3 0 37 0 33 2 2 0 087 4 7 0 51 3 7 0 15 0 021 0 015 0 013 0 009 0 01 0 10 0 020 0 19 050G09 MO 001AE MH c e 1 ME A L seating plane A1 w M b1 e D A2 Z 16 1 9 8 b E pin 1 index 0 5 10 mm scale Note 1 Plastic or met...

Page 12: ... 4 8 0 o o 0 25 0 1 DIMENSIONS inch dimensions are derived from the original mm dimensions Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included 1 1 0 4 SOT162 1 8 16 w M bp D detail X Z e 9 1 y 0 25 075E03 MS 013AA pin 1 index 0 10 0 012 0 004 0 096 0 089 0 019 0 014 0 013 0 009 0 41 0 40 0 30 0 29 0 050 1 4 0 055 0 419 0 394 0 043 0 039 0 035 0 016 0 01 0 25 0 01 0 004...

Page 13: ...for all SO packages Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Several techniques exist for reflowing for example thermal conduction by heated belt Dwell times vary between 50 and 300 seconds depending on heating ...

Page 14: ...get or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause p...

Page 15: ...1997 Jul 15 15 Philips Semiconductors Product specification Stereo BTL audio output amplifier with DC volume control TDA7053A NOTES ...

Page 16: ...Tel 44 181 730 5000 Fax 44 181 754 8421 United States 811 East Arques Avenue SUNNYVALE CA 94088 3409 Tel 1 800 234 7381 Uruguay see South America Vietnam see Singapore Yugoslavia PHILIPS Trg N Pasica 5 v 11000 BEOGRAD Tel 381 11 625 344 Fax 381 11 635 777 For all other countries apply to Philips Semiconductors Marketing Sales Communications Building BE p P O Box 218 5600 MD EINDHOVEN The Netherlan...

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