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July 1994

9

Philips Semiconductors

Product specification

Low voltage mono/stereo power amplifier

TDA7050T

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Summary of Contents for TDA7050T

Page 1: ...DATA SHEET Product specification File under Integrated Circuits IC01 July 1994 INTEGRATED CIRCUITS TDA7050T Low voltage mono stereo power amplifier ...

Page 2: ...exibility in use mono BTL as well as stereo Small dimension of encapsulation see package design example QUICK REFERENCE DATA PACKAGE OUTLINE 8 lead mini pack plastic SO8 SOT96A SOT96 1 1996 July 24 Supply voltage range VP 1 6 to 6 0 V Total quiescent current at VP 3 V Itot typ 3 2 mA Bridge tied load application BTL Output power at RL 32 Ω VP 3 V dtot 10 Po typ 140 mW D C output offset voltage bet...

Page 3: ... heatsink is not applicable the dissipation is limited by the thermal resistance of the 8 pin SO encapsulation until Supply voltage VP max 6 V Peak output current IOM max 150 mA Total power dissipation see derating curve Fig 1 Storage temperature range Tstg 55 to 150 C Crystal temperature Tc max 100 C A C and d c short circuit duration at VP 3 0 V during mishandling tsc max 5 s Fig 1 Power deratin...

Page 4: ...load application BTL see Fig 4 Output power VP 3 0 V dtot 10 Po 140 mW VP 4 5 V dtot 10 RL 64 Ω Po 150 mW Voltage gain Gv 32 dB Noise output voltage r m s value RS 5 kΩ f 1 kHz Vno rms 140 µV RS 0 Ω f 500 kHz B 5 kHz Vno rms tbf µV D C output offset voltage at RS 5 kΩ V 70 mV Input impedance at RS Zi 1 MΩ Input bias current Ii 40 nA Stereo application see Fig 5 Output power VP 3 0 V dtot 10 Po 35 ...

Page 5: ...ig 2 Output power across the load impedance RL as a function of supply voltage VP in BTL application Measurements were made at f 1 kHz dtot 10 Tamb 25 C Fig 3 Output power across the load impedance RL as a function of supply voltage VP in stereo application Measurements were made at f 1 kHz dtot 10 Tamb 25 C ...

Page 6: ...emiconductors Product specification Low voltage mono stereo power amplifier TDA7050T APPLICATION INFORMATION Fig 4 Application diagram BTL also used as test circuit Fig 5 Application diagram stereo also used as test circuit ...

Page 7: ...S inch dimensions are derived from the original mm dimensions Notes 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included 2 Plastic or metal protrusions of 0 25 mm maximum per side are not included 1 0 0 4 SOT96 1 X w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L v M A A 3 A 4 5 pin 1 index 1 8 y 076E03S MS 012AA 0 069 0 010 0 004 0 057 0 049 0 01 0 019 0 014 0 0100 0 0075 0 20...

Page 8: ...cessary to dry the paste and evaporate the binding agent Preheating duration 45 minutes at 45 C Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed A double wave a turbulent wave with high upward pressure followed by a smooth laminar wave soldering technique should be used The longitudinal axis of the package footprint must be parallel ...

Page 9: ...l specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent d...

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