2000 Oct 17
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
PACKAGE OUTLINE
UNIT
Q
bp
Z
c
e
U2
U1
U
F
p
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
99-02-06
IEC
JEDEC
EIAJ
mm
4.0
3.8
0.56
0.46
A
9.5
9.0
0.3
0.2
D
30.1
29.9
E
18.6
18.4
12.8
12.6
4.1
3.9
40.74
40.54
2.54
e1
17.78
3.25
3.15
L
6.5
6.1
7.75
7.55
15.4
15.2
48.0
48.4
0.3
0.25
v
w
0.1
y
DIMENSIONS (mm are the original dimensions)
SOT365A
0
10
20 mm
scale
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT365A
p
U2
F
A
U1
U
D
q
E
L
y
Q
c
v A
A
w
M
bp
Z
2
3
4
1
e1
e
e
