PCB Arts GmbH
Instruction Manual Vapor Phase One
Page
15
of
27
2.3
General operation
A typical vapor phase soldering process is as follows:
1.
Insert the SD card with the solder profile
2.
Switch on the machine
3.
Check the galden & the coolant level
4.
Open the process chamber by "Open Lid" on the touch panel
5.
Place your assembled assembly into the process chamber
6.
Install the PCB probe next to the assembly, suspended in the air. The probe must be
above the highest component to be soldered.
7.
Close the process chamber with "Close Lid" on the touch panel
8.
Check the selected soldering profile
9.
Start the soldering profile via the "Start Reflow" button.
10.
The assembly now moves in the process chamber on the basis of the soldering profile,
and live data is displayed every second in the graphic display.
11.
After the soldering profile is finished, the "Open Lid" button remains grayed out until the
Galden has reached the set "Open Temperature" in the Settings Page.
12.
You can now press "Open Lid" and remove the soldering material
13.
Close the lid again with "Close Lid" so that the process chamber is not contaminated.
Caution:
Only use the soldering material with the enclosed gloves, as the soldering
material is still hot.
2.3.1
Touch panel operation
General:
The operation of the vapor phase soldering system is mainly mapped via the touch panel.
The menu consists of three views:
Process control
,
Graphic display
and
Settings
.
Figure 7: "Process control
