PCB Arts GmbH
Instruction Manual Vapor Phase One
Page
6
of
27
1.
Before operation
1.1
Scope of delivery
•
Vapor Phase One
•
Power cable EU / US
•
SD card
•
USB SD card adapter
•
Injection syringe for emptying the medium
•
Brush for cleaning
•
One pair of cotton gloves (for touch screen applications)
•
Funnel for filling the water tank
•
Torx© T20 key for opening the hose cover
•
Four Torx© T20 replacement screws for the hose cover
1.2
Intended use
The vapor phase soldering system is to be used for soldering printed circuit boards with
assembled components . Temperatures up to a maximum of 240°C are intended. Other uses
of the equipment are not permitted. The limit values specified in this document must not be
exceeded under any circumstances. The operational safety of the equipment supplied is only
guaranteed if it is used as intended.
1.3
Process description
Vapor phase soldering uses a similar physical principle to a heat pipe. A heat source causes a
liquid to boil, i.e. vaporize. This vapor transports the energy of the heat source to the heat
sink - the assembly. The vapor condenses first at the particularly cool points and thus
releases the greatest amount of energy at these points. In the vapor phase soldering system,
a specially developed inert medium is used, which boils between 230°C and 240°C
depending on the type of medium. The condensing vapor gently heats the assembly to the
maximum boiling temperature. Meanwhile, the solder on the assembly liquefies. When the
assembly is removed from the vapor layer, the solder solidifies.
1.4
Process description
First, the soldering chamber is opened by operating the touch panel. After the assembled
component is placed in the soldering chamber on the soldering grid, it can be closed again
with the help of the touch screen. After the soldering chamber is securely closed, it is
possible to start the soldering process via touch panel input.
The heating element brings the soldering medium to its boiling temperature, while the
soldering grid with the assembled component moves along the specified soldering profile.
When the boiling temperature of the soldering medium has been reached, a vapor layer is
