pandaboard OMAP4460 Pandaboard ES, System Reference Manual

Page: 17 / 82

OMAP4460 Pandaboard ES
System Reference Manual
Revision 0.1
September 29, 2011
DOC-21054
Page 17 of 82
2.2 System Clock Distribution
The OMAP4460 Pandaboard ES implements a 38.4 MHz 1.8V CMOS square-wave oscillator that
directly drives the FREF_SLICER_IN input (ball AG8) of the OMAP4460 processor and the MCLK
input to the TWL6040 Audio Companion IC. This clock is used as an input to the PLLs within the
OMAP4460 processor so that it can generate all the internal clock frequencies required for system
operation.
2.3 OMAP4460 Processor
The heart of Pandaboard ES is the OMAP4460 processor. The OMAP4460 high-performance
multimedia application device is based on enhanced OMAP™ architecture and uses 45-nm technology.
For more information, refer to the OMAP4460 Technical Reference Manual (TRM).The architecture is
designed to provide best-in-class video, image, and graphics processing sufficient to various applications.
The device supports the following functions:

Streaming video up to full high definition (HD) (1920 × 1080 p, 30 fps)

2-dimensional (2D)/3-dimensional (3D) mobile gaming

Video conferencing

High-resolution still image (up to 16 Mp)
The device supports high-level operating systems (OSs) such as:

Windows™ CE, WinMobile™

Symbian OS™

Linux®

Palm OS™
The device is composed of the following subsystems:

Cortex™-A9 microprocessor unit (MPU) subsystem, including two ARM® Cortex-A9
cores capable of operation at 1.2GHz

Digital signal processor (DSP) subsystem

Image and video accelerator high-definition (IVA-HD) subsystem

Cortex™-M3 MPU subsystem, including two ARM Cortex-M3 microprocessors

Display subsystem

Audio back-end (ABE) subsystem

Imaging subsystem (ISS), consisting of image signal processor (ISP) and still image
coprocessor (SIMCOP) block

2D/3D graphic accelerator (SGX) subsystem

Emulation (EMU) subsystem
The device includes state-of-art power-management techniques required for high-performance mobile
products. Comprehensive power management is integrated into the device. The device also integrates:

On-chip memory

External memory interfaces

Memory management

Level 3 (L3) and level 4 (L4) interconnects
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