6
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices.
The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge
(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
Precaution of Laser Diode
Caution:
This product utilizes a laser diode with the unit turned “on”, invisible laser radiation is emitted from the pickup lens.
Wavelength: 790 nm (CD)
Maximum output radiation power from pickup: 100
μ
W/VDE
Laser radiation from the pickup unit is safety level, but be sure the followings:
1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.
Summary of Contents for SA-MAX3500PU
Page 11: ...11 5 Location of Controls and Components 5 1 Remote Control Key Button Operation ...
Page 19: ...19 Check Point SMPS PCB Check Point Main PCB 4 5 1 1 2 3 1 7 6 ...
Page 21: ...21 Check Point Main PCB 6 1 2 ...
Page 23: ...23 Check Point Main PCB 1 2 4 3 ...
Page 25: ...25 Check Point MIC pcb Check Point Main PCB 6 2 IC140 IC140 CN140 JK140 JK140 C140 ...
Page 27: ...27 Check Point Tuner PCB Check Point Main PCB Antenna CN5 IC5 SO 1 2 3 4 5 6 7 ...
Page 29: ...29 Check Point Tuner PCB Check Point Main PCB Antenna CN5 IC5 SO 1 2 3 4 5 6 7 ...
Page 31: ...31 Check Point Main PCB 1 3 4 5 6 7 ...
Page 33: ...33 Check Point Main PCB 1 3 4 5 6 7 ...
Page 35: ...35 Check Point Main PCB 2 3 1 ...
Page 46: ...46 ...
Page 56: ...56 ...
Page 82: ...82 ...
Page 104: ...104 MMH1803 ...