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3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an antistatic solder removal device. Some solder removal
devices not classified as "antistatic (ESD protected)" can generate
electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe
all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
"NOTE to CATV system installer :
This reminder is provided to call the CATV system installer's attention to Article 820-40 of the
NEC that provides guidelines for proper grounding and, in particular, specifies that the cable
ground shall be connected to the grounding system of the building, as close to the point of cable
entry as practical."
4. OPERATION GUIDE
5. SERVICE NOTES (PLEASE READ)
5.1. SERVICE NOTES
5.1.1. SIMPLIFIED FAULT FINDING DATA
Simplified Self-Diagnostic System facilitates finding the cause of the fault. A 4 digit for fault code
and communication for I2C bus code will be displayed on TV screen.
7
Summary of Contents for QUASAR PV-C2030W
Page 25: ...Fig D5 25 ...
Page 29: ...6 2 2 Inner Parts Location Fig J1 1 29 ...
Page 30: ...6 2 3 EJECT Position Confirmation Fig J1 2 30 ...
Page 31: ...6 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 31 ...
Page 44: ...6 3 CASSETTE UP ASS Y SECTION 6 3 1 Top Plate Wiper Arm Unit and Holder Unit Fig K1 1 44 ...
Page 82: ...82 ...
Page 86: ...11 2 MECHANISM BOTTOM SECTION 86 ...
Page 87: ...11 3 CASSETTE UP COMPARTMENT SECTION 87 ...
Page 88: ...11 4 CHASSIS FRAME SECTION 1 A B C D E F G 88 ...
Page 89: ...11 5 CHASSIS FRAME SECTION 1 H I J K L 89 ...
Page 90: ...11 6 CHASSIS FRAME SECTION 2 90 ...
Page 91: ...11 7 PACKING PARTS AND ACCESSORIES SECTION A B C D E F G 91 ...
Page 92: ...11 8 PACKING PARTS AND ACCESSORIES SECTION H I J K L 92 ...
Page 113: ...R4021 ERJ6GEYJ473V MGF CHIP 1 10W 47K 113 ...
Page 115: ...R5515 ERDS2TJ332 3 3K 115 ...
Page 135: ...R885 ERDS2TJ104 100K 135 ...