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Multi Chip Discrete 

Publication date: November 2008 

SJF00111AED 

1

 

This product complies with the RoHS Directive (EU 2002/95/EC).

MTM86628

Silicon P-channel MOS FET (FET)

Silicon epitaxial planar type (SBD)

For DC-DC converter
For switching circuits

 Overview

  MTM86628 is the composite MOS FET (P-channel MOS FET and Schottky 

Barrier Diode) that is highly suitable for DC-DC converter and other switching 
circuits. 

 Features

 Built-in schottky barrier diode: V

R

 = 15 V, I

F

 = 700 mA

 Low on-resistance: R

on

 = 300 m

W

 (V

GS

 = –4.0 V)

 Low short-circuit input capacitance (Common source): C

iss

 = 80 pF

 Small surface mounting halogen-free package: WSSMini6-F1 (1.6 mm 

×

 1.6 

mm 

×

 0.5 mm)

 Absolute Maximum Ratings  

T

a

 = 25

°

C

Parameter

Symbol

Rating

Unit

FET

Drain-source surrender voltage

V

DSS

–20

V

Gate-source surrender voltage

V

GSS

±

12

V

Drain current

I

D

–1.0

A

Peak drain current 

*1

I

DP

–4.0

A

Channel temperature

T

ch

150

°

C

Storage temperature

T

stg

–55 to +150

°

C

Total power dissipation

P

D1 

*2

540

mW

P

D2 

*3

150

mW

SBD

Reverse voltage

V

R

15

V

Forward current (Average)

I

F(AV)

700

mA

Junction temperature

T

j

125

°

C

Storage temperature

T

stg

–55 to +125

°

C

Note) *1: t = 10 

µ

s, Duty Cycle < 1%

 

*2: Glass epoxy board: 25.4 mm 

× 

25.4 mm 

×

 0.8 mm

 

    Copper foil of the drain portion should have a area of 300 mm

2

 or more

 

*3: Stand-alone (without the board) 

 Package

 

Code

  WSSMini6-F1 

 

Pin Name

  1: Gate 

4: Cathode

  2: Source 

5: Drain

  3: Anode 

6: Drain

 

 Marking Symbol: PL

 Internal Connection

1

(G)

2

(S)

3

(A)

(K)

4

(D)

5

(D)

6

Summary of Contents for MTM86628

Page 1: ...e WSSMini6 F1 1 6 mm 1 6 mm 0 5 mm Absolute Maximum Ratings Ta 25 C Parameter Symbol Rating Unit FET Drain source surrender voltage VDSS 20 V Gate source surrender voltage VGSS 12 V Drain current ID 1 0 A Peak drain current 1 IDP 4 0 A Channel temperature Tch 150 C Storage temperature Tstg 55 to 150 C Total power dissipation PD1 2 540 mW PD2 3 150 mW SBD Reverse voltage VR 15 V Forward current Ave...

Page 2: ... Ciss VDS 10 V VGS 0 f 1 MHz 80 pF Short circuit output capacitance Common source Coss 12 pF Reverse transfer capacitance Common source Crss 12 pF Turn on delay time td on VDD 15 V VGS 4 0 V ID 0 5A 12 ns Rise time tr 6 ns Turn off delay time td off 17 ns Fall time tf 10 ns Note 1 Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors 2 ton toff me...

Page 3: ..._ RDS on ID Drain source ON resistance R DS on Ω Drain current ID A VGS 2 5 V 4 0 V 5 0 15 20 10 0 20 40 60 120 100 80 MTM86628_ CX VDS Drain source voltage VDS V Short circuit input capacitance Common source C iss Short circuit output capacitance Common source C oss Reverse transfer capacitance Common source C rss pF Ciss Coss Crss Characteristics charts of FET Characteristics charts of SBD IF VF...

Page 4: ...F00111AED This product complies with the RoHS Directive EU 2002 95 EC WSSMini6 F1 Unit mm 0 05 0 02 1 60 0 05 1 00 0 05 0 50 0 50 1 60 0 05 0 10 1 40 0 05 0 50 0 05 0 20 0 05 0 03 0 13 6 5 4 1 2 3 0 to 0 02 5 5 0 15 ...

Page 5: ...han the standard applications intended 4 The products and product specifications described in this book are subject to change without notice for modification and or im provement At the final stage of your design purchasing or use of the products therefore ask for the most up to date Product Standards in advance to make sure that the latest specifications satisfy your requirements 5 When designing ...

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