8
3.4.
Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
• Baking temperature and time (Hour)
80°C / 24 hour
Summary of Contents for HC-VXF990EB
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Page 25: ...25 8 2 PCB Location ...
Page 28: ...28 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Page 29: ...29 Fig D3 Fig D4 ...
Page 30: ...30 8 3 2 Removal of the Wi Fi P C B Fig D5 8 3 3 Removal of the Front Case Unit Fig D6 Fig D7 ...
Page 32: ...32 Fig D10 8 3 6 Removal of the Wi Fi Frame Unit Barrier Motor Unit Lens Frame Unit Fig D11 ...
Page 33: ...33 Fig D12 8 3 7 Removal of the Camera Lens Unit Fig D13 ...
Page 35: ...35 8 3 10 Removal of the Jack DC Gyro P C B Fig D16 8 3 11 Removal of the Main P C B Fig D17 ...
Page 37: ...37 Fig D21 8 3 14 Removal of the SD Door Unit LCD Unit Fig D22 ...
Page 39: ...39 Fig D25 8 3 17 HC VXF990 VXF999 Removal of the LCD Hinge Unit Fig D26 ...
Page 40: ...40 Fig D27 8 3 18 Removal of the Monitor P C B LGP Unit LCD Fig D28 ...
Page 41: ...41 Fig D29 8 3 19 Removal of the Mic P C B Fig D30 ...
Page 42: ...42 8 3 20 Removal of the Front Base Barrier R Barrier F Photo Light P C B Fig D31 Fig D32 ...
Page 44: ...44 Fig D35 8 3 23 Removal of the Kurupon Unit Front P C B Fig D36 ...
Page 49: ...49 Level Shot Adjutment Chart ...
Page 51: ...51 9 1 2 Adjustment Items Adjustment item as follows ...
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