www.paceworldwide.com
Solutions and systems for soldering, r
ework and r
epair of electr
onics
www
.paceworldwide.com
Process Guide I-SOI-10
SOIC Installation
Hot Air Jet (Paste)
Equipment Required
PACE SensaTemp
®
or Intelliheat
®
Power Supply
TJ-70 ThermoJet
®
Flat End Tip (See Chart on Back)
Pik & Paste Liquid Dispensing System
Tip Tool
Optional Equipment
HP-65 HandiPik
®
Tweezer
Manual Solder Paste Dispenser
Materials
Solder Paste
Paste Dispense Needles
Cleaner
Procedure
1.
Start with a heater temperature of 482°C (900°F) and
adjust as necessary.
2.
Install tip into ThermoJet
®
Handpiece using Tip Tool.
3.
Apply a small bead of solder paste along the land
pattern using a dispenser.
4.
Position component onto lands using a HandiPik
®
or
tweezers.
5.
Starting at MINIMUM,adjust pressure output (on power
supply) so hot air scorches a tissue from approximately
0.5cm (0.2”) away.
6.
Direct hot air over component with tip at a distance of
2.5cm (1.0”) to predry solder paste.
7.
When pre-drying is observed (paste has dull, fl at
appearance), bring tip closer (0.5cm [0.2”]) and slowly
move tip along each row of leads to form proper solder
fi llets.
8.
Return ThermoJet
®
to its Tip & Tool Stand.
9.
Clean, if required, and inspect.
A
A
B
C
Apply Solder
C
Adjust Pressure
B
Position Component
D
Pre-dry Paste
© 1997, 2001, 2012 PACE, Incorporated. Hand Soldering Manual for Rework/Repair & Assembly
(001) 910-693-8620 (USA) 877-882-7223
TJ-70
D
E
E
Melt Joints
