18
COMPONENT REMOVAL
Use the following procedure to remove the component. Ensure that the component
and board have been properly prepared (see “Board/Component Preparation”) before
removing component.
1. Set the PCB Assembly so that the component side to be worked on is flat
and steady.
2. Clean the tip and apply a fresh bead of solder to its bottom edges.
3. Position the handpiece
directly over the component
to be removed.
4. Bring the handpiece down
over the component. The
vacuum cup should make
contact with the component
body before the tip makes
contact with the leads. If the
vacuum cup does not make
contact, then the vacuum
pick assembly is not
properly adjusted. Remove
the handpiece and readjust
the pick before proceeding.
PQFP Component
