16
BOARD/COMPONENT PREPARATION
Proper preparation is the key to successful component removal. To obtain optimum
results, this procedure should be followed.
Once you become familiar with the use of the handpiece, you may find it beneficial
to develop procedure variations which comply with your company guidelines.
1. Remove any protective coatings and clean the component leads and land
areas using an approved solvent or cleaner.
2. Ensure that the PCB is free of moisture. You may wish to gently dry the
area using a heated air tool ( i.e., TJ-70 ThermoJet).
3. Preheat the PCB as necessary. PCBs consisting of heat sinking materials
(e.g., ceramic, polyamide, etc.) or those with an exceptionally heavy
ground or power planes may require the use of a preheating system such
as the PACE HotSpot.
