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 Semiconductor Components Industries, LLC, 2013

May, 2013 

 Rev. 0

1

Publication Order Number:

EVBUM2187/D

NB7V33MMNGEVB

NB7V33MMNG
Evaluation Board
User's Manual

Introduction

ON Semiconductor has developed the QFN16EVB

evaluation board for its high-performance devices packaged
in the 16-pin QFN. This evaluation board was designed to
provide a flexible and convenient platform to quickly
evaluate, characterize and verify the operation of various
ON Semiconductor products. Many QFN16EVBs are
dedicated with a device already installed, and can be ordered
from www.onsemi.com at the specific device web page.

This evaluation board manual contains:

Information on 16-lead QFN Evaluation Board

Assembly Instructions

Appropriate Lab Setup

Bill of Materials

This user’s manual provides detailed information on

board contents, layout and its use. It should be used in
conjunction with an appropriate ON Semiconductor device
datasheet located at www.onsemi.com. The datasheet
contains the technical device specifications.

Board Layout

The QFN16 Evaluation Board provides a high bandwidth,

50 

W

 controlled impedance environment and is

implemented in four layers. The first layer or primary trace
layer is 0.008

 thick Rogers RO4003 material, and is

designed to have equal electrical length on all signal traces
from the device under test (DUT) pins to the SMA
connectors. The second layer is the 1.0 oz copper ground
plane and is primarily dedicated for the SMA connector
ground plane. FR4 dielectric material is placed between the
second and third layers and between third and fourth layers.
The third layer is also 1.0 oz copper plane. A portion of this
layer is designated for the device V

CC

 and DUTGND power

planes. The fourth layer is the secondary trace layer.

Figure 1. Top and Bottom View of the 16 QFN Evaluation Board

Top View

Bottom View

http://onsemi.com

EVAL BOARD USER’S MANUAL

Summary of Contents for NB7V33MMNG

Page 1: ...It should be used in conjunction with an appropriate ON Semiconductor device datasheet located at www onsemi com The datasheet contains the technical device specifications Board Layout The QFN16 Eval...

Page 2: ...1 Pin 2 Pin 3 Pin 4 Pin 13 Pin 14 Pin 15 Pin 16 Pin 8 Pin 7 Pin 6 Pin 5 DUT_GND SMA_GND VCC VEE DUTGND SMA_GND Figure 4 Evaluation Board Layout 4 Layer LAYER 1 TOP SIDE 1 OZ ROGERS 4003 0 008 in LAYE...

Page 3: ...ended to be tied to VEE DUTGND the negative supply of the device The positive power supply connector is labeled VCC Depending on the device the negative power supply nomenclature is labeled either GND...

Page 4: ...several user dependent LVDS output measurement techniques For LVDS lab setup and test a single supply is typically used ie VCC 3 3 V and DUTGND 0 V Installing the SMA Connectors Each configuration in...

Page 5: ...No Wire No No No No No GND GND GND VCC No No VCC VCC VCC No VCC NOTE DUTGND VEE Exposed Pad and must be tied to DUTGND VEE CONFIGURATIONS SMAGND SMAGND VCC DUTGND VEE ExPad Figure 6 Power Supply Confi...

Page 6: ...he test measurement device must contain 50 W termination VEE DUTGND Power Supply GND 0 V VCC Trigger Test Measuring Equipment Channel 1 Channel 2 DUTGND VEE ExPad SMAGND Table 2 POWER SUPPLY LEVELS Ou...

Page 7: ...4 http www keyelco com Chip Capacitor AVC Corporation 0603 0 01 mF 10 06035C103KAT2A na http www avxcorp com 0603 0 1 mF 10 0603C104KAT2A 2 Chip Resistor Panasonic 0402 50 W 1 Precision Thick Film Ch...

Page 8: ...NB7V33MMNGEVB http onsemi com 8 Figure 9 Gerber Files Top Layer Second Layer SMA_GND Plane...

Page 9: ...NB7V33MMNGEVB http onsemi com 9 Figure 10 Gerber Files Third Layer DUT_GND Trace Bottom Layer...

Page 10: ...ther applications intended to support or sustain life or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur Should B...

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