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K6PM-TH Thermal Condition Monitoring Device User’s Manual (H231)
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Overview and Features
This section describes an overview and features of the Main Unit.
The Main Unit and the K6PM-TH sensor are used together to measure and monitor the surface tem-
perature of devices in the control panel. A maximum of 31 infrared thermal sensors can be connected
to one Main Unit. The surface temperature of devices in the control panel is measured with the infrared
thermal sensor.
Use the software tool to make the Main Unit settings.
The Main Unit can monitor the temperature of devices in the control panel by the following three meth-
ods:
Monitoring with Main Unit
1) Set an alarm threshold for the Main Unit, and perform judgment output from the Main Unit based on
transistor output.
Monitoring with Software Tool
2) Perform monitoring with the software tool via Ethernet.
Monitoring with PLC or PC
3) Perform monitoring from the PLC or PC via Ethernet (EtherNet/IP or Modbus TCP).
1-1-1
Outline
Monitoring
Setting and monitoring
Monitoring
Infrared thermal sensor
RS-485
Measurement target
31 Units max.
Transistor output 1
Software tool
PC
(EtherNet/IP communications or
Modbus TCP communications)
Thermal condition
monitoring device
K6PM-TH
PLC
Summary of Contents for K6PM-TH
Page 56: ...2 Installation and Wiring 2 20 K6PM TH Thermal Condition Monitoring Device User s Manual H231...
Page 76: ...3 Initial Setting 3 20 K6PM TH Thermal Condition Monitoring Device User s Manual H231...
Page 156: ...7 Troubleshooting 7 8 K6PM TH Thermal Condition Monitoring Device User s Manual H231...
Page 195: ...I 1 I K6PM TH Thermal Condition Monitoring Device User s Manual H231 Index...
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