SECURITY
STATUS
NXP Semiconductors
JN-RM-2080
K32W module development reference manual
JN-RM-2080
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Reference manual
Rev. 1.0
— 27 Mar 2020
19 of 30
Contact information
For more information, please visit:
6. Manufacturing considerations
The HVQFN package must be considered carefully when using reflow solder techniques.
Package footprint information can be found in the K32W061/041 data sheet.
The decal is shown in Fig 17. The pad stacks used are 0.25 mm by 1 mm for the smaller
pads, and a 6.4 mm square pad for the paddle.
Warning: Solder resist area recommended
Fig 17. Recommended PCB decal for HVQFN40 40-pin QFN
The solder mask used is shown in
. The pad stacks used are 0.25 mm by 1 mm
for the smaller pads, and four 1.6 mm square pads to apply paste to the paddle. The
solder paste mask has a thickness of 6-thou (0.152 mm). If the paste thickness needs
to deviate from that used NXP then it may be necessary to change the number of pads
that the paste is applied to. Paste thickness may be dictated by additional components
used in a design.
NOTE
– Solder resist area:
A specific connection used on NXP production line has to be handled carefully when
the layout is done (see nest figure)
Extra connection Forbidden routing
Fig 18. Extra test pin
