Numark MIXSTREAM PRO, Service Manual

Page: 48 / 54

1
1
2
2
3
3
4
4
5
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D D
C C
B B
A A
7
200 Scenic View Dr.
Cumberland, RI 02864 7 3/18/2021 Sheet: of
AMP.SchDoc
INM-PCB-NH08-RearPanel.PrjPcb
Originally Drawn By:
Project:
Sheet:
Variant: Default
Last Modified By:
Last Modified:
Copyright 2021, inMusic Brands
All Rights Reserved
Rev J
Layout Notes
12.1.3.1 Device, Copper, and Component Layout
Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures. These tips should be
followed to achieve that goal:
• Avoid placing other heat producing components or structures near the amplifier (including above or below in the end equipment).
• If possible, use a higher layer count PCB to provide more heat sinking capability for the TAS5805M device and to prevent traces and
copper signal and power planes from breaking up the contiguous copper on the top and bottom layer.
• Place the TAS5805M device away from the edge of the PCB when possible to ensure that the heat can travel away from the device on
all four sides.
• Avoid cutting off the flow of heat from the TAS5805M device to the surrounding areas with traces or via strings. Instead, route traces
perpendicular to the device and line up vias in columns which are perpendicular to the device.
• Unless the area between two pads of a passive component is large enough to allow copper to flow in between the two pads, orient it so
that the narrow end of the passive component is facing the TAS5805M device.
• Because the ground pins are the best conductors of heat in the package, maintain a contiguous ground plane from the ground pins to the
PCB area surrounding the device for as many of the ground pins as possible.
GND_AMP
I2S_AMP
BCLK_AMP
LRCK_AMP
GND_AMP GND_AMP
1uF
25V C132
1uF
25V C134
GND_AMP 0.22uF
25V C136
0.22uF
25V C135
0.22uF
25V C133
0.22uF
25V C131
1
5
.0
K
R
1
2
7
GND_AMP
Left+
Left-
Right+
Right-
470uF
25V
+ C117
470uF
25V
+ C118
AMP_nPDN
AMP_nFAULT
AMP_I2C_SCL
TO SPEAKERS
Ad dre sss 0 x5 A
0
.6
8
u
F
5
0
V
C
1
3
8
GND_AMP
0
.6
8
u
F
5
0
V
C
1
3
0
GND_AMP
0
.6
8
u
F
5
0
V
C
1
2
6
GND_AMP
C
E
R
A
M
IC
-X
7
R
1
2
0
6
0
.6
8
u
F
5
0
V
C
1
1
6
18mA
twisted
GND_AMP
1,000pF
16V C139
PASSING FROM GND TO GND_AMP PLANE
PLACE CLOSE TO BCLK and SDOUTx TRACES
0.00 R128 0.00
0.00
R129 0.00
0.00
R130 0.00
2
2
u
F
3
5
V
C
1
2
0
2
2
u
F
3
5
V
C
1
1
9
2
2
u
F
3
5
V
C
1
2
3
2
2
u
F
3
5
V
C
1
2
4
4
7
u
F
6
.3
V
C
1
2
7
1Kohm
L12
10.
0
K
R
13
1
DGND
1
DVDD
2
ADR/nFAULT
3
VR_DIG
4
DGND
5
LRCLK
6
SCLK
7
SDIN
8
SDOUT
9
SDA
10
SCL
11
nPDN
12
AVDD
13
AGND
14
PVDD
15
PVDD
16
OUT_B+
17
BST_B+
18
PGND
19
OUT_B-
20
BST_B-
21
BST_A-
22
OUT_A-
23
PGND
24
BST_A+
25
OUT_A+
26
PVDD
27
PVDD
28
PAD
29
U17
TAS5805M
0
.1
u
F
2
5
V
C
1
2
1
0
.1
u
F
2
5
V
C
1
2
2
0
.1
u
F
2
5
V
C
1
2
8
0
.1
u
F
2
5
V
C
1
4
0
TP1
TP
1
2
J15
SIL S HR OU DE D 2 .0 mm
1
2
J16
SIL SHROUDED 2.0mm
4
.7
5
K
R
1
2
5
4
.7
5
K
R
1
2
6
AMP_I2C_SDA
+3.3V
+3.3V
+VSYS +VSYS
GND_AMP
GND
GND
L10
10uH
L11
10uH
L13
10uH
L14
10uH
TP20
TP21
TP22
TP23
GND_AMP GND
0.1uF
50V C234
0.1uF
50V C235
EMC OPTION
1
0
u
F
1
0
V
C
2
3
6