PRECESSION ELEPHANT 2 Scan Head 2
13.8 Options
Process control options
•
Customized suction cups for integrated particle extraction with external pressure
control
•
Through-the-lens vision module with internal sample illumination
•
Polarization control for sharpest edges over complete circumference
•
High-speed laser stop for consistent edge results on exit surface
•
Energy monitor for long-time process stability
•
Optical beam attenuator
•
Confocal detector
•
Plasma emission sensor
•
Single pulse energy measurement sensor
•
Beam position and profile monitor
Set-up options
•
2 alignment cameras for beam adjustment
•
Beam position and beam profile monitoring
•
Automatic calibration of the beam position and direction
•
Safety shutter
13.9 Typical process parameters
Table 23: Typical process parameters
Typical process parameters
Material thickness
0.02 to1.5 mm
Hole processing time
0.5 s
Hole diameters
25 to 700 µm
Negative taper full angle
> 16°
Hole aspect ratio
> 12:1
89
