Preface
3
0 to 60 centigrade is the suitable temperature. (The figure comes from the
request of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and
contraction from the welding spots’ that connect components and PCB.
Computer should go through an adaptive phase before it boots when it is
moved from a cold environment to a warmer one to avoid condensation
phenomenon. These water drops attached on PCB or the surface of the
components can bring about phenomena as minor as computer instability
resulted from corrosion and oxidation from components and PCB or as
major as short circuit that can burn the components. Suggest starting the
computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of
computer. Using the close case may decrease the life of other device
because the higher temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature
may decrease the life of the device and burned the capacitor.
User’s Notice
Copyright of this manual belongs to the manufacturer. No part of this manual,
including the products and software described in it may be reproduced,
transmitted or translated into any language in any form or by any means
without written permission of the manufacturer.
This manual contains all information required to use this mother-board series
and we do assure this manual meets user’s requirement but will change,
correct any time without notice. Manufacturer provides this manual “as is”
without warranty of any kind, and will not be liable for any indirect, special,
incidental or consequential damages (including damages for loss of profit, loss
of business, loss of use of data, interruption of business and the like).