User’s Manual U16896EJ2V0UD
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CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
The V850ES/KE1+ should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 30-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD703302GK-xxx-9ET-A:
64-pin plastic TQFP (12
×
12)
μ
PD703302YGK-xxx-9ET-A: 64-pin plastic TQFP (12
×
12)
μ
PD70F3302GK-9ET-A:
64-pin plastic TQFP (12
×
12)
μ
PD70F3302YGK-9ET-A:
64-pin plastic TQFP (12
×
12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less, Exposure limit: 7 days
Note
(after that, prebake at 125°C for 20
to 72 hours)
IR60-207-3
Wave soldering
For details, contact an NEC Electronics sales representative.
−
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
−
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1.
Products with -A at the end of the part number are lead-free products.
2.
For soldering methods and conditions other than those recommended below, please contact an NEC
Electronics sales representative.
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