Appendix C Micro SMD Wafer Level
Chip Scale Package, PCB, Layout,
and Mounting Considerations
Refer to Application Notes ( AN-1112) for more information
on Micro SMD Wafer Level Chip Scale Package.
Since National Semiconductor is constantly pursuing the best
package performance possible, please refer to the following
web page for possible updates to the
μ
SMD package infor-
mation presented in Appendix D: <http://www.national.com/
an/AN/AN-1112.pdf.
www.national.com
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