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Chapter 4
Mechanical Considerations
Figure 4-3.
Mounting on a Panel or Plate with an Attached Heat Sink
Managing Thermal Conditions
Due to the compact size of the sbRIO-9651 SOM, it is very important to appropriately dissipate
the heat generated during operation. You must plan for the thermal conditions of your
application throughout development and validation. This section provides design
recommendations and validation tools and methods for maximizing the thermal performance
of the system.
Designing a Suitable Enclosure
NI sbRIO devices operate as components in a higher-level system and may require an enclosure
to protect the internal circuit card assembles and dissipate heat. For the sbRIO-9651 SOM, the
system integrator is responsible for designing an enclosure that meets the thermal requirements
of your specific application.
1
Exploded view of all mounting components
2
Complete assembled and mounted view
3
Mounting surface
4
Carrier board
5
Standoff, 7.15 mm (0.2
8
1 in.)
6
sbRIO-9651 SOM
7
Mounting screw, 16.00 mm (0.630 in.)
1
2
7
5
3
4
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