NAT-AMC-ZYNQUP-FMC
T
ECHNICAL
R
EFERENCE
M
ANUAL
V1.1
I
NTRODUCTION
- 9 -
2.2.
Main Features
Table 1
–
Technical Data
Form Factor
•
Single-width, full-size or mid-size AMC
•
Width: 73.5 mm, Depth: 180.6 mm
Processing Resources
•
Xilinx Zynq Ult FPGA MPSoC; choice of ZU7EG, ZU11EG
•
GTH transceiver speed: 12.5GHz
FPGA
•
4 GB DDR4 SDRAM (x64)
Memory extension slot for additional SRAM or DDR4
CPU
•
Quad-core ARM Cortex-A53 processor (application processing unit)
•
Dual-core ARM Cortex-R5 (real-time processing unit)
•
GPU
•
4 GB DDR4 SDRAM (x64)
•
QSPI or eMMC boot flash memory
•
MicroSD card slot
Microcontroller
•
Atmel ATxmega128 as MMC
Software /
Firmware
•
IPMI 1.5 compliant
•
Linux boot
–
Linux drivers
•
API for all external/internal interfaces
FPGA Programming Interface
•
Front panel USB/JTAG connector
•
JTAG over backplane connections
•
Onboard Xilinx header connector
FMC Slot
•
Single HPC FMC slot
•
VITA 57.1 compliant (with limitations, see chapter 5.3.1)
•
HPC differential pairs (LA/HA/HB) are routed to the FPGA
•
DP0 to DP9 are routed to the FPGA
•
Support of region 1,2, and 3* FMC modules
Backplane Interconnect
•
Ports 0/1: Dual 1GbE connect
•
Ports 2/3: FPGA-LVDS-I/Os
•
Ports 4-15: PCIe/Ethernet/custom protocol
•
Ports 17-20: Custom protocol FPGA-LVDS-I/Os
•
Any combinations of PCIe, SRIO, 10/40GbE (on request)
•
AMC TCLKA-D and FCLKA connectivity
Front Panel
•
Optional clock IN/OUT
•
USB/JTAG-Connector
•
SD card slot
•
AMC front panel elements and application LEDs
Compliance
•
AMC.0 R2.0, AMC.1, AMC.2, AMC.3, AMC.4, IMPI V1.5, HPM.1
•
EN60950, UL1950, RoHS
Environmental
Operating
Environment
•
0 to +55 degrees Celsius (extended temperature range on request)
•
Humidity: 5% to 95% (non-condensing)
Storage
Environment
•
-40 to +100 degrees Celsius
•
Humidity: 5% to 95% (non-condensing)
