Multitech MultiConnect MTPCIE-BW, Developer'S Manual

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REGULATORY STATEMENTS
40 MultiConnect
®
PCIe MTPCIE-H5/MTPCIE-BW Developer Guide
Chapter 7 – Regulatory Statements
EMC, Safety, and Radio Equipment Directive (RED) Compliance
The CE mark is affixed to this product to confirm compliance with the following European Community Directives:
Council Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical
and electronic equipment;
and
Council Directive 2014/53/EU on radio equipment and telecommunications terminal equipment and the
mutual recognition of their conformity.
MultiTech declares that this device is in compliance with the essential requirements and other relevant provisions
of Directive 2014/53/EU. The declaration of conformity may be requested at
https://support.multitech.com .
Restriction of the Use of Hazardous Substances (RoHS)
Multi-Tech Systems, Inc.
Certificate of Compliance
2011/65/EU
Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations
set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment - RoHS).
These MultiTech products do not contain the following banned chemicals
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:
Lead, [Pb] < 1000 PPM
Mercury, [Hg] < 1000 PPM
Hexavalent Chromium, [Cr+6] < 1000 PPM
Cadmium, [Cd] < 100 PPM
Polybrominated Biphenyl, [PBB] < 1000 PPM
Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM
Environmental considerations:
Moisture Sensitivity Level (MSL) =1
Maximum Soldering temperature = 260C (in SMT reflow oven)
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Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration
would be found in some modules (>1000 PPM);
- Resistors containing lead in a glass or ceramic matrix compound.