MSC CXC-BT
User Manual
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1.3 Introduction
COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer
Group), is a module concept to bring PCI Express and other latest technologies like SATA, USB
2.0 and LVDS on a COM (Computer On Module).
A COM Express™ module is plugged onto an application-specific base board and offers a
migration path to future CPU technologies as they become available. Utilizing different form
factors
, COM Express™ can be used for deeply embedded solutions all the way up to high
performance platforms.
The design of the MSC CXC-BT module supports the Intel® Atom-Series System-on-Chip
(SOC) platform enabling the embedded application to provide high power efficiency.
For evaluation and design-
in of the COM Express™ modules MSC offers evaluation
baseboards and development motherboards providing the interface infrastructure for the COM
Express™ module using PC type connectors for external access.
Currently four module sizes are defined in the COM Express Specification 2.1: the Mini Module,
the Compact Module, the Basic Module and the Extended Module. The main difference
between them is the over-all physical size and the performance envelope supported.
All module sizes of the same type use the same connectors and pin-outs and utilize several
common mounting hole positions. This level of compatibility permits a carrier board designed to
accommodate an Extended Module to also support a Basic or Compact Module.
Up to 440 pins are available between COM Express™ modules and the Carrier Board.
To enhance interoperability between COM Express™ modules and Carrier Boards, seven
common signaling configurations (Pin-out Types) have been defined to ease system integration.
