![MSC Technologies Avnet COM Express CXC-BT User Manual Download Page 25](http://html1.mh-extra.com/html/msc-technologies/avnet-com-express-cxc-bt/avnet-com-express-cxc-bt_user-manual_1846822025.webp)
MSC CXC-BT
User Manual
25 / 84
2.10.8
USB
Signal
Pin
Type
Signal
Level
Power
Rail
Remark /
Tolerance
PU/PD/SR
Description
Source / Target
USB[0:3]+
USB[0:3]-
I/O
USB
3.3V Sus 3.3V
USB differential pairs, channels 0 through 3
Note: default enabled as EHCI in BIOS
BT SOC
USB[4:7]+
USB[4:7]-
I/O
USB
3.3V Sus 3.3V
USB differential pairs, channels 4 through 7
Note: default disabled in BIOS, only available when XHCI is
enabled, ,see also USB tech note (
Fehler! Verweisquelle
konnte nicht gefunden werden.
)
(Wake up from suspend states at USB ports 4-7 is not supported.)
USB HUB
USB_0_1_OC#
I
CMOS 3.3V Sus 3.3V
ePU = 10
KΩ USB channels 0 and 1 over-current sense.
A pull-up for this line is present on the module. An open drain driver
from a USB current monitor on the Carrier Board may drive this line
low. Do not pull this line high on the Carrier Board.
BT SOC
USB_2_3_OC#
I
CMOS 3.3V Sus 3.3V
ePU = 10
KΩ USB channels 2 and 3 over-current sense.
A pull-up for this line is present on the module. An open drain driver
from a USB current monitor on the Carrier Board may drive this line
low. Do not pull this line high on the Carrier Board.
BT SOC
USB_4_5_OC#
I
CMOS 3.3V Sus 3.3V
ePU = 10
KΩ USB channels 4 and 5 over-current sense.
A pull-up for this line is present on the module. An open drain driver
from a USB current monitor on the Carrier Board may drive this line
low. Do not pull this line high on the Carrier Board.
USB HUB
USB_6_7_OC#
I
CMOS 3.3V Sus 3.3V
ePU = 10
KΩ USB channels 6 and 7 over-current sense.
A pull-up for this line is present on the module. An open drain driver
from a USB current monitor on the Carrier Board may drive this line
low. Do not pull this line high on the Carrier Board.
USB HUB
Considerable care must be taken when using high speed signals on the carrier board. Reliable functionality depends on the following factors:
a. Trace length on the carrier board
b. Number of vias used on the carrier board
c. PCB material and specification used for the carrier board
d. Target device