6.
Mechanical Characteristics
6.1
Module Outline Drawings
Figure 6-1. ATSAMA5D27-WLSOM1 Module Drawing
1
2
3
4
5
6
7
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9
10
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89
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92
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169
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184
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127
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128
TP10
TP11
TP2
TP9
TP1
TP3
TP7
TP6
TP8
GND
TP4
PIN 1 CORNER
S
A
TOP VIE
W
P1b
aaa
P2
fff
fff x n
E
D
e
BO
TT
OM VIE
W
P2Eb
P2Ea
jjj
jjj x m
Tests Points
Origin in mm
X
Y
Pads :
Body :
188
40.8 x 40.8 x 3.287
B01
SAMA5D27-WLSOM1_POD
11/15/2019
SAMA5D27-WLSOM1 DIMENSIONS
Drawn by : R C R
Pads Pitch :
0.8
P1t
aaa
P2
fff
n x
dA1
dA2
RevB.0 - 0000027
1941000
ATSAMA5D27-WLSOM1
MICROCHIP
Table 6-1. ATSAMA5D27-WLSOM1 Module Dimensions (in mm)
Symbol
Common Dimensions
Comments
Min.
Typ.
Max.
Body Size
X
E
40.700 40.800 40.900
Y
D
40.700 40.800 40.900
Pad Pitch
e
–
0.800
–
PCB Thickness
S
1.150
1.200
1.250
Total Thickness
A
–
3.287
3.387
Pad Length
Top Side
P1t
–
0.800
–
Bottom Side
P1b
–
1.500
–
Pad Width
P2
–
0.600
–
Solder Mask Defined 0.550
Pad Space
aaa
–
0.200
–
SAMA5D27 Wireless SOM1
Mechanical Characteristics
©
2021 Microchip Technology Inc.
and its subsidiaries
Complete Datasheet
DS60001590D-page 52
