Micrel, Inc.
MIC24056 Evaluation Board
February 11, 2013
3
Revision 1.0
Evaluation Board Performance
Die Temperature* :
The temperature measurement was taken at the hottest point on the MIC24056 case mounted on a 5 square inch 4 layer, 0.62 inch,
FR-4 PCB with 2oz finish copper weight per layer, see the
Thermal Measurement
section in the MIC24056 datasheet. Actual results will depend upon
the size of the PCB, ambient temperature and proximity to other heat-emitting components.
50
55
60
65
70
75
80
85
90
95
100
0
3
6
9
12
15
E
F
F
ICI
E
NCY
(
%
)
OUTPUT CURRENT (A)
Efficiency (VIN = 5V)
vs. Output Current
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
VIN = 5V
50
55
60
65
70
75
80
85
90
95
100
0
3
6
9
12
15
E
F
F
ICI
E
NCY
(
%
)
OUTPUT CURRENT (A)
Efficiency (VIN = 12V)
vs. Output Current
5.0V
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
VIN = 12V
0
20
40
60
80
100
0
2
4
6
8
10
12
D
IE T
EM
PER
A
T
U
R
E
(
°
C)
OUTPUT CURRENT (A)
Die Temperature* (VIN = 5V)
vs. Output Current
VIN = 5V
V
OUT
= 1.8V
0
20
40
60
80
100
0
2
4
6
8
10
12
D
IE T
EM
PER
A
T
U
R
E
(
°
C)
OUTPUT CURRENT (A)
Die Temperature* (VIN = 12V)
vs. Output Current
VIN = 12V
V
OUT
= 1.8V
