MeiG_SLM156_Hardware Design Manual
MeiG Smart Technology Co., Ltd
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High-temperature high-humidity
test
temp85°C, humidity95%RH, last for 48h in shut down
state
Low temperature operation test
temperature-30°C, last for 24h in operation state
High temperature operation test
temp75°C,last for 24h in operation state
Vibration test
Carry on vibration test following the requirements below:
frequency
Random vibration ASD (acceleration
spectral density)
5~20Hz
0.96m2/s3
20~500Hz
0.96m2/s3(20Hz), other -3dB/octave
Connector service life test
Board-to-board connector interface plugging 50 times; RF
antenna interface cable plugging 30 times
ESD test
1 testing power PAD under calling state and large-sized ground,
ESD meets:
Contact discharge should pass ±4KV, ±5KV test level
Air discharge should pass ±8KV, ±10KV test level
2 tes
ting EVB’s SIM card slot under shut-down mode, ESD
meets:
Contact discharge should pass ±4KV test level
Air discharge should pass ±8KV test level
3
、
other interfaces of the module, ESD meets:
Contact discharge should pass ±1KV test level
Air discharge should pass ±2KV test level
6.9 ESD Features
When the module is in application, static on human body or generated by friction among micro-
electronic will pass to the module through various discharge means, and thus may cause some damage
to the module. So high attention must be paid to ESD protection. Static protection measures should be
taken in both the process of R&D and Production, such as adding ESD protection in circuit design and
wearing anti-static gloves in the process of production and debugging.
Please refer to the following table for ESD-permitted discharge range.
Table 32 ESD performance parameter (temperature: 25°C, humidity: 45%)
Testing point
Contact discharge
Air discharge
Unit
VBAT,GND
±5
±10
KV
Other interface
±1
±2
KV
