4
Rev. B
For more information
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
Terminal Voltages:
V
IN
n
(Note 4), SV
IN
, I
IN
+
, I
IN
−
...................... –0.3V to 18V
(SV
IN
– I
IN
+
), (I
IN
+
– I
IN
−
) ........................... –0.3V to 0.3V
SW0, SW1 .................. −1V to 18V, −5V to 18V Transient
INTV
CC
, EXTV
CC
........................................... –0.3V to 6V
V
OUT
n
........................................................ –0.3V to 3.6V
V
OSNS0
+
, V
OSNS1
+
......................................... –0.3V to 6V
V
OSNS0
−
, V
OSNS1
−
...................................... –0.3V to 0.3V
RUN
n
, SDA, SCL,
ALERT
........................... –0.3V to 5.5V
FSWPH_CFG, VOUT
0,1_
CFG,
VTRIM
0,1_
CFG, ASEL ......................... –0.3V to 2.75V
FAULT
n
, SYNC, SHARE_CLK, WP,
PGOOD0, PGOOD1 ............................... −0.3V to 3.6V
COMPna, COMPnb, .................................. –0.3V to 2.7V
TSNS0a, TSNS1a ...................................... –0.3V to 2.2V
TSNS0b, TSNS1b ...................................... –0.3V to 0.8V
Temperatures
Internal Operating Temperature Range
(Notes 2, 13, 16, 17) .............................. –40°C to 125°C
Storage Temperature Range .................. –55°C to 125°C
Peak Solder Reflow Package Body Temperature ... 245°C
(Not recommended for upside down reflow.)
(Note 1)
1
2
3
4
5
6
7
8
9
10
11
12
M
L
K
J
H
G
F
E
D
C
B
A
GND
GND
GND
V
OUT0
GND
INTV
CC
V
DD33
F
SWPH_
CFG
V
OUT0_
CFG
SHARE
CLK
V
OUT1_
CFG
V
TRIM1_
CFG
EXTV
CC
GND
RUN1
PGOOD1
PGOOD0
V
OSNS0
+
V
OSNS0
–
TOP VIEW
BGA PACKAGE
144-LEAD (16mm × 16mm × 7.82mm)
T
JMAX
= 125°C,
θ
JCtop
= 3.3°C/W,
θ
JCbottom
= 2°C/W,
θ
JB
= 2°C/W,
θ
JA
= 7°C/W
WEIGHT = 7.4 GRAMS
GND
V
OUT0
V
OSNS1
+
V
OSNS1
–
V
OUT1
V
OUT1
SGND
V
IN0
V
IN1
SW0
SW1
SV
IN
I
IN
+
I
IN
–
V
DD25
ASEL
V
TRIM0_
CFG
RUN0
FAULT0
ALERT
FAULT1
COMP0b SDA
COMP0a
COMP1b
COMP1a
SYNC
SCL
TSNS0a
TSNS1a
TSNS0b
TSNS1b
WP
ORDER INFORMATION
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(See Note 2)
DEVICE
FINISH CODE
LTM4680EY#PBF
SAC305 (RoHS)
LTM4680Y
e1
BGA
4
–40°C to 125°C
LTM4680IY#PBF
LTM4680Y
LTM4680IY
SnPb (63/37)
LTM4680Y
e0
Contact the factory for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
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Recommended LGA and BGA PCB Assembly and Manufacturing
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