124
Rev. B
For more information
PACKAGE DESCRIPTION
A
DET
AIL B
PACKAGE SIDE VIEW
A2
BGA Package
144-Lead (16mm
×
16mm
×
7.82mm)
(Reference LTC DWG # 05-08-1583 Rev C)
DET
AIL B
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
H3
aaa
bbb
ccc
ddd
eee
fff
MIN
7.57
0.50
1.72
0.60
0.60
0.27
1.45
5.35
NOM
7.82
0.60
1.82
0.75
0.63
16.00
16.00
1.27
13.97
13.97
0.32
1.50
5.40
MAX
8.07
0.70
1.92
0.90
0.66
0.37
1.55
5.45
0.15
0.10
0.20
0.30
0.15
0.35
TOT
AL NUMBER OF BALLS: 144
BGA 144
1118 REV C
TRA
Y PIN 1 BEVEL
PACKAGE IN TRA
Y LOADING ORIENT
ATION
COMPONENT
PIN “A1”
DET
AIL A
Øb (144 PLACES)
M
X
Y
Z
ddd
M
Z
eee
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. A
LL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNA
TION PER JESD MS-028 AND JEP95
4
3
DET
AILS OF PIN #1 IDENTIFIER ARE OP
TIONAL,
BUT MUST BE LOCA
TED WITHIN THE ZONE INDICA
TED.
THE PIN #1 IDENTIFIER MA
Y BE EITHER A MOLD OR
MARKED FEA
TURE
PACKAGE TOP VIEW
4
PIN “A1” CORNER
X
Y
aaa Z
aaa Z
D
E
15.65
DIMENSIONS
NOTES
BALL HT
BALL DIMENSION
PAD DIMENSION
SUBSTRA
TE THK
MOLD CAP HT
INDUCTOR HT
Z
SUBSTRA
TE
INDUCTOR
A1
ccc Z
// bbb Z
// ff
f Z
H2
H1
H3
b1
MOLD CAP
Z
15.60
L TMXXXX
5. PRIMAR
Y DA
TUM -Z- IS SEA
TING PLANE
6
PACKAGE ROW AND COLUMN LABELING MA
Y V
AR
Y
AMONG µModule PRODUCTS. REVIEW EACH P
ACKAGE
LA
YOUT CAREFULL
Y
!
PACKAGE BOT
TOM VIEW
3
SEE NOTES
DET
AIL A
PIN 1
b
e
e
b
F
G
G
F
E
A
B
D
C
H
M
L
K
J
2
1
4
3
5
6
7
12
8
9
10
11
7
SEE NOTES
SUGGESTED PCB LA
YOUT
TOP VIEW
0.0000
0.0000
0.630 ±0.025 Ø 144x
0.6350
0.6350
1.9050
1.9050
3.1750
3.1750
4.4450
4.4450
5.7150
5.7150
6.9850
6.9850
6.9850
5.7150
5.7150
4.4450
4.4450
3.1750
3.1750
1.9050
1.9050
0.6350
0.6350
6.9850
