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LGE Internal Use Only
Copyright ©
LG Electronics. Inc. All rights reserved.
Only for training and service purposes
List the basic steps that should typically be followed to remove components and materials requiring
selective treatment:
1.OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations
of items contained within the product which require selective treatment
(with descriptions and arrows identifying locations) can be inserted below:
1
Unlock screw (
“
A-17EA
”
) and (
“
B-4EA
”
)to separate back cover assembly.
Unlock screw (
“
C-4EA
”
) to separate the base.
[Fig.1]
2
Separate the cushion (D,E) from backcover.
[Fig.2]
3
Unlock screw (
“
F-5EA
”
) to sepparate power board .
Unlock screw (
“
F-4EA
”
) to sepparate main board and AV bracket(G,H).
Unlock screw (
“
F-8EA
”
) to sepparate wall moun
ti
ng bracket.
[Fig.3]
5
Unlock screw (
“
A-1EA
”
) to separate wi
fi
assembly from module backcover.
Separate the wi
fi
bracket (J) from wi
fi
assembly.
[Fig.5]
4
Separate the receive assembly from front cover;
Separate the receive board from IR LENS;
Separate the PC sheet (I) from IR LENS.
[Fig.4]
Product Disassembly Process