Following
components
soldered
on
the
top
side
of
the
system
board
are
extremely
sensitive.
When
you
service
the
system
board,
avoid
any
kind
of
rough
handling.
a
Accelerometer
chip
for
the
HDD
Active
Protection
System
b
Security
chip
c
CPU
d
Video
chip
e
MCH
(Memory
Controller
Hub)
f
ICH
(I/O
Controller
Hub)
Bending
or
flexing
the
system
board
can
cause
ball
grid
array
(BGA)
connections
to
crack
(unzip).
a
b
c
d
e
f
Removing
and
replacing
a
FRU
108
MT
1951,
1952,
1953,
1954,
1955,
1956,
2007,
2008,
2009,
2613,
2623,
and
2637