3: Mounting Instructions and PCB Footprint
xPico® 110 Embedded Device Server Integration Guide
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3. Mounting Instructions and PCB Footprint
The xPico
110 dimensions and mounting instructions are shown in
. You may also directly access the CAD files through the Lantronix
website.
Reflow Profile Guideline
The reflow profile is dependent on many factors including flux selection, solder composition,
and the capability of the user's reflow equipment.
Lantronix does not recommend a specific reflow profile but provides the following general
guidelines:
♦
The solder composition typically sets the peak temperatures of the profile.
♦
Lantronix recommends lead free solder pastes SAC305: Type 4. Water soluble or no-
clean solder pastes are acceptable.
♦
Reflow equipment is needed at nine heater zones at minimum. Lantronix recommends a
forced air type reflow oven with nitrogen.
♦
Lantronix recommends that the peak temperature at the solder joint be within 235°C ~
245°C, and the maximum component temperature should not exceed 260°C.
♦
Lantronix recommends that the solder joint heating time above 217°C last between 40-90
seconds, and at a minimum of 40 seconds.
♦
Excessive ramp/cooling rates (>3°C/s) should be avoided.
♦
To develop the reflow profile, Lantronix recommends that the user place thermocouples
at various locations on the assembly to confirm that all locations meet the profile
requirements. The critical locations are the module solder joints.
♦
When developing the reflow profile, Lantronix recommends that a fully loaded assembly
be used to assure that the total thermal mass is accounted for.
Figure 3-1 Recommended Reflow Profile
