HDK8450 (SM8450P) Processor User Guide
Main board
80-28453-2 Rev. C Confidential
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11
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
3.2 Hardware specification
Table 3-2 HDK8450 Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
SM8450P
Qualcomm®
Snapdragon™
8450 Processor
▪
Qualcomm® Kryo™ 780 CPU built on Arm Cortex
technology
▪
Qualcomm® Adreno™ 730 GPU for the highest in
graphics performance and power efficiency
▪
Qualcomm Spectra™ 680 Image Signal Processor for
the ultimate photography and videography experiences
▪
Adreno 665 VPU for high-quality, ultra HD video
encode and decode
▪
Adreno 1195 DPU for on-device and external ultra HD
display support
▪
3G/4G/5G modem
– mmWave and sub-6 GHz bands
(Rel 16 integrated modem)
▪
Low-power audio subsystem combined with the
Qualcomm Aqstic™ Audio Technologies
WCD9380/WCD9385 audio codec for low-power voice
processing and audiophile quality audio playback
▪
Qualcomm® Snapdragon Sensors Core Technology for
contextual awareness and always-on sensor support
▪
Qualcomm® Secure Processing Unit (SPU260) for
advanced secure use cases
▪
Qualcomm® Hexagon™ Tensor Processor (HTP) with
Hexagon Vector eXtensions (HVX) and Hexagon
Matrix eXtensions (HMX)
▪
Qualcomm® FastConnect™ 6900 System with
WCN685x, 802.11ax, 2 × 2 MIMO, Bluetooth 5.2
▪
Quad-channel package-on-package (PoP) high-speed
LPDDR5 SDRAM
▪
14.0 × 15.0 mm MPSP1518 PoP
Qualcomm®
PMIC,
Companion
PMIC for
SM8450P
processor
(PMK8450,
PM8450,
PM8350,
PM8350C,
PM8150B,
PM8010 and
PM735A)
PMK8450
The PMK8450 device serves as a clock generation and
distribution IC.
▪
Three dedicated low dropouts (LDOs) for clocks
One for the crystal oscillator
One for the RFCLK output buffers
One for the LNBB output buffers
▪
38.4/76.8 MHz XO support
▪
Special-purpose clock outputs
▪
Five 76.8/38.4 MHz RF clock outputs
Three 19.2 MHz LNBB clock output
One 32.7645 kHz sleep clock output
▪
Two-line serial power management interface (SPMI)
▪
On-chip ADC
▪
Real time clock (RTC)
▪
4 GPIOs (1.8 V)
▪
Package
36-pin fanout wafer picoscale package (FOWPSP36)
2.13 × 2.13 × 0.55 mm; 0.35 mm pitch
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