
GNSS Receiver Module A5135-H User Guide
24
7 Mounting
This chapter describes the suggested mounting process for the A5135-H GNSS re-
ceiver modules. In a RoHS, compliant product with a RoHS compliant process it is
recommended to use chemical tin as the counter-part to the module’s pins. This will
guarantee highest resistance against shocks.
7.1 Proposed Footprint for Soldering
The following proposal of a footprint for soldering is assuming a stencil thickness of
150µm.
marks the center of the through holes.
Figure 11: Proposal of Soldering footprint
Please note that copper and solder paste footprints are identical. The final footprint
should be evaluated and qualified by the manufacturer according to the specific pro-
cess.
7.2 PCB Design Guide
1. Drill a through hole with diameter greater than or equal to 3mm in the application
PCB which is underneath the RF feed-point to alleviate the interference from RF sig-
nal to other part of circuitries. Besides, ground vias (says, 8) should be placed sur-
rounding the through hole for further shielding purpose.
Figure 12: Proposal (1) of the PCB design