BTM410/411
Bluetooth
®
AT Data Module
76
www.lairdtech.com
Laird Technologies
APPLICATION NOTE
FOR
SURFACE MOUNT
MODULES
Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured including reflow
soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder
paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird
Technologies’ surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Figure 10: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 9-1.
Table 9-1: Recommended Maximum and minimum temperatures
Recommended Max & Min's
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
3
°C / Sec
Temperature Decrease rate (goal)
2-3
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
60
Sec
Flux Soak Period (Max)
90
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
60
Sec
Time Above Liquidous (min)
20
Sec
Time In Target Reflow Range (goal)
30
Sec
Time At Absolute Peak (max)
30
Sec
Liquidous Temperature (SAC305)
217
°C
Lower Target Reflow Temperature
225
°C
Upper Target Reflow Temperature
250
°C
Absolute Peak Temperature
260
°C
IMPORTANT:
During reflow, modules should not be above 260°C and not for more than 30
Summary of Contents for BTM410
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