Kirisun DM588, Service Manual

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DM588 Service Manual
Appendix 2 Material List (Electronic Part)
Table 1 Material List of Main Board DM588-01 (136MHz-174MHz)
SN Material NO Material Name Specifications QTY Component NO
1 6SS1-4324-HMC2
SMD nesting for Main
board DM588-01 (with
GPS module, without
Bluetooth and POC
modules)
LT1901 chip based, 136~174 MHz 1
2
2CC1-20-X5R160-1
06KD
Multi-layer chip
capacitor
2012, 10uF±10%, 16V, TAIYO,
EMK212ABJ106KD-T, 0.85±0.1mm high
51
C1,C2,C28,C29,C30,C31,C32,C35,C307,C403,C4
04,C448,C527,C530,C533,C535,C312,C315,C537
,C538,C540,C541,C47,C85,C88,C149,C236,C237
,C338,C348,C44,C46,C50,C370,C371,C373,C374
,C376,C377,C381,C382,C399,C55,C60,C418,C42
1,C444,C445,C521,C525,C547
3
2CC1-10-X5R500-1
04K
Multi-layer chip
capacitor
1005, 100nF±10%, 50V, X5R 46
C3,C8,C12,C18,C19,C22,C33,C34,C36,C37,C38,
C41,C45,C52,C308,C528,C529,C531,C532,C534,
C536,C313,C314,C316,C317,C318,C319,C320,C
321,C322,C323,C100,C102,C87,C90,C91,C92,C9
5,C96,C103,C53,C54,C356,C466,C503,C510
4
2CC1-10-X7R250-2
23K
R multi-layer chip
capacitor
1005, 22nF±10%, 25V, X7R 5 C4,C9,C13,C24,C460
5
2CC1-32-X5R500-1
06K
Multi-layer chip
capacitor
1206, 10UF,50V, ±10%, X5R,
GRM31CR61H106KA12#
8 C5,C14,C15,C16,C17,C23,C465,C509
6
2CC1-10-C0G500-1
51J
R multi-layer chip
capacitor
1005, 150P±5%, 50V, C0G 32
C6,C10,C393,C462,C81,C82,C83,C84,C125,C127
,C140,C142,C153,C172,C176,C177,C181,C182,C
215,C219,C221,C384,C476,C477,C250,C251,C25
2,C255,C61,C331,C565,C580
41