Section 2: S535 site preparation and installation
S535 Wafer Acceptance Test System Administrative Guide
2-22
S535-924-01 Rev. B / January 2019
Cleaning
: Use lint-free swabs moistened with methanol or isopropyl alcohol to clean contaminated
connectors and then blow-dry them with nitrogen gas. After blowing dry, wait several minutes before
using.
Lockout and tagout
For maximum safety while power is applied, always perform a lockout and tagout procedure. Remove
power from the entire test system and discharge capacitors before connecting or disconnecting
cables or any instrument, including the device under test. When you perform lockout and tagout
procedures, make sure that you read all warning labels on the cabinet and instruments (see the
following figure).
Figure 25: Hazardous warning label
Severe personal injury or death due to electric shock or electrocution may result if power is
not removed before working inside the cabinet. Always perform the lockout and tagout
procedure before opening the system cabinet. Also, never turn on the system until all
connections and safety grounds are installed.
