ii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE S755TWIN MOTHER-BOARD AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion
Revision History
Date
1.0
First Release
April 2003
Item Checklist
5
S755TWIN Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
5
Cable for Serial ATA IDE Port
5
SPDIF-IN/SPDIF-OUT Adaptor
5
S755TWIN User’s Manual
AMD K8 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with increasing operation
clock, thermal management becomes increasingly crucial while building computer systems. Maintaining
the proper computing environment without thermal increasing is the key to reliable, stable, and 24
hours system operation. The overall goal is keeping the processor below its specified maximum case
temperature. Heatsinks induce improved processor heat dissipation through increasing surface area
and concentrated airflow from attached active cooling fans. In addition, interface materials allow
effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD
recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.
Please refer to the website below for collection of heatsinks evaluated and recommended for Socket-A
processors by AMD. In addition, this collection is not intended to be a comprehensive listing of all
heatsinks that support Socket-754 processors.
For vendor list of heatsinks and Active cooling fans, please visit
：
http://www.amd.com/us-en/Processors/DevelopWithAMD/0,,30_2252_869_9460^9515,00.html
