IRadimed MRidium 3860, Service Manual

Page: 51 / 118

3-1
SECTION 3
PREVENTIVE MAINTENANCE AND SYSTEMS TEST
3.0 PREVENTIVE MAINTENANCE
3.1
Introduction
This section contains preventive maintenance instructions, service mode
operating procedures, troubleshooting routines, disassembly and reassembly
procedures and a comprehensive operational performance test for the
MRidium 3860+, 3861 and 3865 MR IV pump and accessories. Please
reference Section 5 for drawings and exploded views of the various
assemblies, components, and PCB’s.
This section provides detailed system test and verification steps as well as a
complete discussion of preventive maintenance (PM) procedures. The
individual technician will be well served to create an appropriate level of PM
procedures pulling from those contained below, for their institution using their
own judgment and historical processes applicable for other types of IV pump
PM’s as currently being performed, ie: electrical safety, IV pump flow testing
and the like. PM procedures which are significant and/or unique to the
mRidium MR IV pump are described in section 3.2, and should become part of
any institutional specific PM process.
3.2 Preventive Maintenance
The MRidium 3860+ Infusion Pump/Controller, 3861 SideCar Secondary
Pump and 3865 Remote Display/Charger are designed and assembled with
the goal of minimizing maintenance requirements. The integral microproces-
sor of the 3860+ incorporates a diagnostic routine that monitors the instru-
ment's subsystems and operating parameters. Detection of operating system
irregularities or failures that affect the instrument's functional operation acti-
vates audio and visual Alarms or Malfunction alerts for operator notification.
Problems of this nature are recorded in the non-volatile RAM history log for
subsequent use by technical personnel in performing troubleshooting and
repair actions.
Maintenance-free operation between regularly scheduled preventive mainte-
nance inspections can be enhanced by performing routine cleaning on an as
required basis. The recommended interval for preventive maintenance inspec-
tions is once a year based on normal use and operation. Verification of proper
CAUTION
Printed circuit board assemblies (PCBA’s) are easily damaged when integrated
circuits are removed and replaced. Excessive heat applied to the circuit board
traces and pads can cause delamination of the metal foil and base material.
Damage of that type is essentially irreparable; therefore, only low-temperature
soldering irons and vacuum solder removal tools should be used when removing
and replacing components on PCBA’s. Leads on integrated circuit components
should be cut before attempting to un-solder and remove.
In addition CMOS devices are sensitive to static electrical charges and may be
damaged during repair if the repair activity is not performed in an ESD protected
environment using approved ESD protective procedures.