Table 6-2.
TDP and T
CASE
Specifications - 245W/260W SKUs
Processor
Processor with Fabric
Workload
CPU Centric
Memory Centric
CPU Centric
Memory Centric
CPU Power
215W
177W
215W
177W
Memory Power
30W
68W
30W
68W
IOP Fabric Die Power
N/A
15W
Total Power
245W
260W
CPU Die Maximum T
CASE
72
°
C
N/A
1
74
°
C
N/A
1
MCDRAM Die Maximum T
CASE
N/A
2
N/A
1
N/A
2
N/A
1
Fabric Die Maximum T
CASE
N/A
N/A
3
Minimum T
CASE
4
5
°
C
Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
43
Thermal Specifications and Design Guidelines
.
Notes:
1.
Memory-centric workloads: CPU T
CASE
is expected to be lower than the maximum CPU T
CASE
target. The
MCDRAM die are expected to remain below their maximum allowable temperature, as long as the thermal
solution provides adequate cooling to the CPU die.
2.
CPU-centric workloads: Memory T
CASE
is expected to be lower than the maximum memory T
CASE
target.
3.
Fabric die T
CASE
targets: The fabric die is expected to remain below it’s maximum allowable temperature for
all workloads, as long as the thermal solution provides adequate cooling to the CPU and MCDRAM die.
4.
ASHRAE thermal envelopes allow scenarios where the data center ambient temperature may drop below
5
°
C, down to 0
°
C. However, the processor silicon temperatures are expected to quickly rise above 5
°
C
once operational. Contact your Intel representative if you believe your data center implementation
warrants further consideration of minimum operational temperatures down to 0
°
C.
CPU-centric workloads are those applications that are heavily compute-intensive and
are able to concentrate the code and data within the processor’s on-die cache. These
applications would be expected to maximize the power consumption of the CPU silicon
and reduce the MCDRAM power. As an example, applications that make extensive use
of the Intel
®
Advanced Vector Extensions (Intel
®
AVX) instructions would be
considered CPU-centric.
Memory-centric workloads would typically be working with data sets that require
significant transfers between the processor silicon and the on-package MCDRAMs, or
perhaps even the off-package DDR4 system memory. These applications would be
expected to maximize the power consumption of the MCDRAM silicon and reduce the
CPU die power consumption.
Thermal Design Power (TDP) of the processor is not the same as the absolute
maximum possible power draw. TDP is the maximum continuous power dissipation that
has been measured when running commercially-available benchmarks and
applications. Applications often have very short duration power spikes (10s to 100s of
micro-seconds) above TDP. These short power spikes are not thermally significant, but
they do require the power delivery system to be designed appropriately.
What happens in the unlikely event that an application is developed that continuously
draws more power than TDP? The answer depends on a variety of factors, but one of
the key factors is the system ambient temperature. If the ambient temperature is
below the maximum specified for the chassis, the thermal solution may have enough
headroom to keep the processor within its defined temperature range. If the ambient
temperature is close to maximum, the processor may reach, or exceed, its maximum
permissible operating temperature. In this situation, the system and processor will
pursue multiple actions to ensure staying below temperature targets.
