Intel Xeon Phi Processor x200, Thermal/Mechanical Specification And Design Manual

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Table 4-1. Bolster Plate Mechanical Load Specifications
Parameter Min. Max. Notes
Total Heatsink Static Compressive Load 138 lbf (EOL) 300 lbf (BOL) 1, 3
Dynamic Load (with heatsink installed) N/A 132 lbf 1, 2
TIM Activation Pressure 20 psi N/A
Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
37

Retention Assembly Mechanical Design
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. Dynamic loading is defined as heatsink mass (0.6 kg) x 50 g load superimposed for an 11 ms duration
average on the static load requirement.
3. Bolster plate designs for the processor with fabric must meet an additional criteria (min. total static
compressive load, BOL), as given in Table 3-2 . To achieve this, additional factors such as loading module
tolerances, package stack tolerances, load degradation, etc. must be considered.
Table 4-2. Back Plate Design Criteria
Parameter Value Note
Material thickness 2.2 mm To meet the PCB secondary side
clearance requirement.
Does not include insulator thickness.
Insulator thickness 0.178 mm
Tensile yield strength 250 MPa
Flatness within 0.2 mm Measured in unconstrained state, see
drawing notes in Appendix E-1 .
PEM * Insert Pull-out Force 667 N Self-clinching backplate studs
PEM Insert Torque Out 2.25 N-m Self-clinching backplate studs
Outside perimeter 81.6 x 108.6 mm Customizing beyond this perimeter of
back plate should meet the reliability
objectives.
Cavity (7 total cutouts) See back plate mechanical drawings for
details.
Table 4-3. Bolster Plate Design Criteria
Parameter Value Note
Material thickness 1.5 mm To meet the PCB primary side clearance
requirement
Insulator thickness 0.178 mm
Tensile yield strength 758 - 930 MPa
Flatness 1.0 mm Measured in unconstrained state, see
drawing notes in Appendix E-4 .