Figure 3.
DIMM Population Within a Channel for Two Slots per Channel
CLK_DP/DN:
Processor
D
I
M
M
0
0/1
0/1
D
I
M
M
1
1
2/3
2/3
Chip Select:
ODT:
0
0/2
1/3
CKE:
Fill
Second
Fill
First
All allowed DIMM population configurations for two slots per channel are shown in the
following table.
Table 2.
UDIMM Population Configurations Within a Channel for Two Slots per Channel
Configuratio
n Number
POR Speed
1N or
2N
DIMM0
DIMM1
1
DDR3-1333 & 1066
1N
Empty
Single-rank
2
DDR3-1333 & 1066
1N
Empty
Dual-rank
3
DDR3-1333 & 1066
2N
Single-rank
Single-rank
4
DDR3-1333 & 1066
2N
Single-rank
Dual-rank
5
DDR3-1333 & 1066
2N
Dual-rank
Dual-rank
1.7
Thermal and Mechanical Components
Table 3.
Thermal and Mechanical Components
Name
Description
Standard Processor Thermal
Solution Mounting
The CRB supports full power processor thermal solution mounting
provisions as delineated in the processor's Thermal/Mechanical Design
Guidelines.
Processor Fan
The CRB provides fan headers for the processors that includes 12V.
Heatsink
The CRB supports heatsink mounting requirements.
continued...
Crystal Forest—Introduction
Intel
®
Xeon
®
Processor E3-1125C with Intel
®
Communications Chipset 8910 Development Kit
User Guide
October 2012
12
Order No.: 328009-001US
