Intel® Server System R2000WF Product Family Technical Product Specification
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4.
Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between 10 °C and
35 °C with limited excursion based operation up to 45 °C, as specified in Table 4. Working with integrated
platform management, several features within the system are designed to move air in a front to back
direction, through the system and over critical components to prevent them from overheating and allow the
system to operate with best performance.
Figure 29. System Airflow and Fan Identification
The following tables provide air flow data associated with the different system models within this 2U product
family and are provided for reference purposes only. The data was derived from actual wind tunnel test
methods and measurements using fully configured (worst case) system configurations. Lesser system
configurations may produce slightly different data results. In addition, the CFM data provided using server
management utilities that utilize platform sensor data may vary slightly from the data listed in the tables.
Note
: For system BTU data, see the Intel® Server Board S2600WF Product Family Power Budget and Thermal
Configuration Tool.
Table 37. System volumetric airflow, Intel® Server System R2308WFxxx
System Fan
PSU Fan
Total Airflow (CFM)
100%
auto
136.2
100%
100%
141.5
55%
auto
70.8
Table 38 . System volumetric airflow, Intel® Server System R2308WFxxx w/Intel® Xeon Phi™ (passive)
System Fan PSU Fan Total Airflow (CFM)
100%
auto
170.6
100%
100%
173.3
55%
auto
86.5
Summary of Contents for R2000WF series
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