Thermal/Mechanical Specifications and Design Guidelines
77
Mechanical Drawings
Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)
(78.25
)
(36.00
)
(18.72
)
37.54
0.00
25.81
13.67
35.21
35.21
40.71
13.67
4X
6.00
4X
10.00
(61.02
)
4X
R1.8
(52.00
)
26.00
0.00
10.80
7.05
26.00
18.00
18.00
9.36
9.36
(27.33
)
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
SIZE
DRAWING NUMBER
REV
A1
E21319_REV_L_PAE
L
SCALE:
1.000
DO NOT SCALE DRAWING
SHEET
2
OF
2
BOARD SECONDARY SIDE
2
2
WEST
EAST
SOUTH
NORTH
SOCKET
& PROCESSOR
VOLUMETRIC KEEP-IN
INTEL PN E21320
COMPONENT VOLUMETRIC
KEEPINS
SOCKET
& PROCESSOR
VOLUMETRIC KEEP-IN OUTLINE
ROUTING KEEPOUTS
LEGEND
COMPONENT KEEP-OUT
ROUTING AND COMPONENT KEEP-OUT
MAX COMPONENT HEIGHT 2.54MM
Summary of Contents for i5-700
Page 30: ...Independent Loading Mechanism ILM 30 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...Mechanical Drawings 88 Thermal Mechanical Specifications and Design Guidelines...
Page 94: ...Socket Mechanical Drawings 94 Thermal Mechanical Specifications and Design Guidelines...
Page 98: ...Package Mechanical Drawings 98 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Heat Sink Back Plate Drawings 102 Thermal Mechanical Specifications and Design Guidelines...